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Kulicke & Soffa Thermosonic Gold Ball Wire Bonder
This thermosonic gold ball wire bonder is used to make electrical interconnections between a microchip and the outside world in the semiconductor device fabrication process. Gold wire is used with this particular bonder, and the bonding processes use a combination of heat, pressure, and ultrasonic energy to make a weld at each end of the wire. The gold wire that can be used can have a diameter range between 18 to 76um. It comes with a Bausch & Lomb StereoZoom 4 Microscope (0.7X to 3.0X), a pair of 10X Eyepieces, and a heated workholder.